Boeing (NYSE: BA) has partnered with Intel (Nasdaq: INTC) to develop next-generation aerospace industry capabilities that are enabled by advanced semiconductor technology.
The collaboration is focused on the use of Intel 18A Silicon Complementary Metal-Oxide Semiconductor fabrication process to design and create secure and autonomous Boeing products, the aerospace and defense company said Tuesday.
Boeing and Intel are looking into microelectronics applications to produce foundational semiconductors and high-performance edge-computing offerings in addition to advanced flight capabilities.
The partnership is also anticipated to enhance the technical skills of the Boeing workforce and enable an accelerated design-to-commercialization process.
“Our collaboration with Boeing is yet another opportunity to harness the power of Intel’s unmatched silicon offerings for Boeing’s world-class aerospace systems critical to our nation’s global competitiveness,” said Cameron Chehreh, vice president and general manager of Intel Public Sector and a Wash100 awardee.
Chehreh is one of the key figures participating in ExecutiveBiz’s 2023 Microelectronics Forum on July 25. Join other semiconductor experts, government officials and industry leaders to learn more about the future of microelectronics following the momentum of the 2022 CHIPS Act. Register here!
