BAE Systems has accepted from Intel (Nasdaq: INTC) and Qorvo (Nasdaq: QRVO) the first set of multichip prototypes developed under the Department of Defense’s State-of-the-art Heterogeneous Integrated Packaging program.
Intel delivered its multichip package for SHIP’s digital segment and Qorvo handed over to BAE its multichip module for the initiative’s radio frequency aspect, DOD said Thursday.
Heidi Shyu, undersecretary of defense for research and engineering, said the SHIP program is one of the steps DOD is taking to protect the U.S. military’s tech advantage.
“This is a momentous occasion, and it reinforces our commitment to returning the United States to a dominant position in the microelectronics industry,” added Shyu, a 2023 Wash100 awardee.
In October 2020, Intel’s federal arm and Qorvo received other transaction agreements to develop MCPs under the SHIP program.
Intel said it built and delivered to BAE the prototypes six quarters ahead of schedule.
Breaking Defense reported BAE accepted the prototypes during a ceremony held Thursday at its Falls Church, Virginia-based facility and will transition the devices into electronic warfare systems.
