The Defense Advanced Research Projects Agency is seeking industry comments on a draft program announcement for the first and second phases of a program to establish a U.S.-based center for research, development and manufacturing of 3D heterogeneously integrated microsystems.
A notice posted Monday on SAM.gov states that the Next-Generation Microelectronics Manufacturing Program Phase I has anticipated funding worth $420 million for installing equipment, establishing baseline fabrication processes, developing a 3D assembly design kit and designing 3DHI automation and simulation software.
DARPA will allocate the same funding amount for Phase II to create hardware prototypes, automate processes and develop emulation capabilities.
The agency anticipates releasing the final NGMM program announcement on Nov. 20, with proposal submissions due on Feb. 22.
DARPA expects work to commence on July 1, 2024.
